AnacondaPimpHand t1_ir1y6zt wrote on October 4, 2022 at 7:08 PM

Reply to comment by ddelisle in Micron’s investing $100 billion to bring the country’s ‘largest semiconductor fabrication facility’ to New York by Avieshek

The chips coming out of these fabs are still in wafer form. They are shipped to another factory for “dicing”. Dicing is a much simpler process than the actual manufacture of the chips so I believe most of it is done overseas (cost saving).

DePasse t1_ir4e2r1 wrote on October 5, 2022 at 6:55 AM

Following the dicing packaging needs to be done as well. Purely diced dies are not usable as they cannot be integrated into usual electronics without a first level package for most use cases.